Furukawa Tape
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「Furukawa Tape」文章包含有：「DicingDieAttachFilm」、「ForprotectiontransferprocessesUVtape」、「FurukawaElectric」、「Products」、「TapeforBackgrinding」、「TapeforDicing｜Aboutus」、「TapeforSemiconductorProcess」、「TapeforSemiconductorProcess」、「Technology」
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Dicing Die Attach Film
https://www.furukawa.co.jp
Furukawa Electric products are suited to a variety of applications. We will introduce much suitable tape to your process, Just inform us device/application and ...
For protectiontransfer processes UV tape
https://www.furukawa.co.jp
UV tape. This adhesive tape has a good stability (of adhesive strength shift). It is suitable for carrier/transfer process.
Furukawa Electric
https://www.jipal.com
Furukawa Electric. 首頁 · 產品服務 · 半導體 · Furukawa Electric · Non-UV Tape for Bumped Wafer Back Grinding<BR>CP9206M-430.
Products
https://www.furukawa.co.jp
Tape for Backgrinding. These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
Tape for Backgrinding
https://www.furukawa.co.jp
This is protection tape for circuit of semiconductor wafer surface in back grinding process. Feature. Suitable for thin wafer grinding caused by stress ...
Tape for Dicing｜About us
https://www.furukawa.co.jp
This tape is used to hold semiconductor wafer during dicing/singulation process. Feature. Strong Adhesion before UV Irradiation. Easy Peel-off after UV ...
Tape for Semiconductor Process
https://www.furukawa.co.jp
We are supporting front line of semiconductor industry with Advanced Tape and Advanced Film Technology. Read more · Tape for Backgrinding. Tape for Dicing.
Tape for Semiconductor Process
https://www.furukawa.co.jp
Tape for Backgrinding. These tapes are designed for surface protection of semiconductor wafers during backgrinding process. See more. Tape for Dicing.
Technology
https://www.furukawa.co.jp
Our back-grinding tape for SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.